BGA Reballing Station, HT-90 Reballing Station Diagonal Universal Stencil Solder Aluminum Alloy Rework Kit for Laptop CPU

Specification: Item Type: BGA Reballing Station Product Model: HT-90 90x90 Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in Material: Aluminum alloy Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products. Package List: 1 x BGA Reballing Station1 x Hex Wrench

• 【Exquisite Workmanship】-- This product is a BGA universal diagonal ball planting fixture, all aluminum alloy coating.
• 【Reasonable Design】-- The station is made of high-quality aluminum alloy material, and the structure is light and durable.
• 【Easy to Operate】-- Adjust the chip size knob and set the diversion groove to facilitate pouring out the excess tin beads.
• 【Long Service Life】-- The BGA reballing station is more wear-resistant, and is more suitable for planting 9mm to 43mm BGA chip balls.
• 【Wide Range of Applications】-- Used for laptop CPU, mobile digital products plant tin rework with BGA manual welding